Used SHINKAWA UTC-1000 Super #9130281 for sale

SHINKAWA UTC-1000 Super is a multi-functional wire and ribbon bonder designed for high-precision bonding operations. It is suitable for a wide range of applications, including miniature and power components, power module packages, RF shielding materials, LED displays, and substrates. SHINKAWA UTC-1000SUPER features a robust, space-saving design that offers flexibility and performance in the most demanding applications. The device utilizes a high resolution microscope with a digital camera to accurately inspect and monitor the bonding area before, during, and after the bonding operation. The on-board computer system offers real-time monitoring of the wire feed manufacturer, bonding time, bonding wire type, and users can store up to 20 recipes for their bonding processes. The device also features a patented servo drive system that provides ultra-precise bond wire placement. UTC 1000 SUPER has an operator-friendly LCD touch panel with intuitive menu that displays a variety of operating functions. The device also includes a comprehensive programming and operation manual to get existing and new users up and running quickly. In addition to precision wire and ribbon bonding, SHINKAWA UTC 1000 SUPER can be used for TAB bonding, as well as advanced flip chip bonding, and manual insertion of small components. It is equipped with an automatic tip exchange function which allows the user to quickly and easily exchange the less than 0.1mm diameter tips without having to shut the machine down. The device also features an auto-speed control option that allows the bondheads to be adjusted from 200mm/s to 6,000mm/s and includes up to 32 layout programs for actual product runs. UTC-1000SUPER is appropriate for businesses such as biomedical, military, and automotive electronics. It is CE compliant and ISO 9001, so you can be assured of its quality and reliability. UTC-1000 Super is an ideal choice for businesses seeking a versatile, reliable, and high-precision solutions for their very complex applications.