Used SHINKAWA UTC-1000 Super #9186601 for sale

SHINKAWA UTC-1000 Super is a next-generation advanced wire and die bonder with outstanding performance and stability. It has a broad range of features and capabilities, making it ideal for exacting production environments. SHINKAWA UTC-1000SUPER is a Table Top bonder, suitable for die attachment and wire bonding applications. Its precision adjustable X, Y, and Z axes enable precise positioning of substrate and bond materials, and its two independent 5-axis motorized stages enable excellent manipulation and control. The bonder also boasts two independent multi-axis motorized stage devices that offer precise Z-axis positioning and stress-free multi-axis bond techniques for both Wire and Die bond applications. The Z-axis stages are capable of involving small force control actuation down to 0.005 newtons with an accuracy of 1-micron and a resolution of <1-micron. The bonder also features advanced imaging technology for exact placement and alignment. It houses a high-end 5-axis camera which enables automatic and precise alignment of the substrate and bond material, eliminating the need for manual inspections. UTC 1000 SUPER includes a feeder system with zero-error internal mechanisms that ensure exceptional product quality and a consistent accuracy of + 0.1 microns. This automated with additional auto-calibration tear-off device with robot heads ensures reliable operation. SHINKAWA UTC 1000 SUPER is an innovative tool designed to meet the highest production needs. Its reliable performance and enhanced control features make it the perfect choice for exacting industrial bond operations. With its advanced technology and exceptional product quality, it is ideal for high-volume production.