Used SHINKAWA UTC-1000 Super #9201828 for sale

SHINKAWA UTC-1000 Super Bonder is the benchmark in automated thermosonic wire bonding technology. It is designed for high-volume production and offers high-quality results with a wide variety of products. This bonder is suitable for industrial, medical, optoelectronics, aerospace, automotive, and consumer applications. SHINKAWA UTC-1000SUPER Bonder is designed with an innovative servo-motor driven wire pusher and axial wafer rotator for high-speed and high-productivity. It has a built-in high-precision digital feedback control system and has a wide application range of 0.2mm to 0.5mm diameter wire. Its maximum bond force is 15gf, making it suitable for fine-pitch wirebond and adhesive bonded technologies. This bonder has a four-axis programmable loop controller. Its accuracy is ±4% and enables various loop shapes, such as circular, regular offset, square, and customized bond shapes, to be designed and programmed. It has software features to enable repair and bridge bonds, multi-axis rotation, and wire placement with high accuracy. This combined with its high speed, high stability, and accurate placement, make it suitable for multipoint ball bonding. UTC 1000 SUPER Bonder is equipped with an advanced Touch Screen Programming and Controlling Interface. This allows the user to view and monitor the bonding process and adjust it in real-time for improved performance. It also includes Advanced Diagnostics, which can detect errors in the process, as well as report tooling reliability, wire weaving information, and wafer alignment movement. Overall, UTC-1000 Super Bonder is a versatile bonder, minimizing downtime and increasing production yields. This bonder is easy to setup, highly reliable, and has dynamic alignment and looping for precision and intricate patterns. It is the ideal bonder for a wide range of applications in the industrial, medical, optoelectronics, aerospace, automotive, and consumer sectors.