Used SHINKAWA UTC-1000 Super #9222458 for sale

SHINKAWA UTC-1000 Super is a high-precision bonder designed to meet the precise bonding requirements of the semiconductor industry. It is capable of performing a wide range of bond operations including ultrasonic wire bonding, thermocompression bonding, and thermo-sonic bonding. SHINKAWA UTC-1000SUPER's advanced design offers precise control of all parameters, allowing adaptation of the bonding operation to fit a wide variety of materials and applications. The latency of the bonder's operation is very high, resulting in minimal downtimes and maximum production capability. The machine features a precise bond pitch stabilization equipment which keeps the wire at a stable speed for high quality, precise wire bonds. The machine is equipped with a wide variety of bond programs, including multi-level, multi-angle, and wedge bond programs. UTC 1000 SUPER is constructed with a main body made of high-grade aluminum alloy. The control system is composed of a PLC (programmable logic controller) and touch panel for monitor and control. The machine utilizes a vibration-controlled acceleration unit to provide precise control of wire tension and acceleration, ensuring accurate wire bond formation. The machine can handle a variety of wire sizes and shapes, including round, square and rectangular. The wire feed mechanism is designed to prevent corrosion and the influence of dust and dirt, resulting in higher throughput and improved reliability. In addition, the wire feeder is equipped with an anti-skid feature which helps reduce frictional losses during bonding operations, allowing for higher and smoother wire bond formation. SHINKAWA UTC 1000 SUPER is equipped with a number of safety systems to ensure the operator's and machine's safety. This includes a protection circuit which prevents the bonder from overheating or pointing too close to the operator. Additionally, the machine is equipped with a self-diagnostic tool which alerts the operator to potential asset errors. In summary, UTC-1000SUPER is a highly-precise bonding machine designed to meet the bond requirements of the semiconductor industry. Its advanced design provides precise control of all parameters and its high latency and vibration controlled acceleration model ensure top-tier wire bonds. The machine features a wide variety of bond programs and is equipped with a number of safety systems to ensure the operator's and machine's safety.