Used SHINKAWA UTC-1000 Super #9299263 for sale

SHINKAWA UTC-1000 Super is a high-tech, automated wire-bonding machine that offers precise, efficient wire bonding within a wide range of products and applications. The machine combines multiple functions in one compact and affordable system. It combines the functionality of a ball and wedge bonder, capillary bonder, flip chip bonder, and robotic automation. SHINKAWA UTC-1000SUPER's revolutionary design allows for a range of bonded products such as ultra-fine and micro-miniature wire bonds, as well as standard wire bonding processes. It's precision and speed is invaluable for high-volume manufacturing operations where time and cost-saving is key. The machine's high operating speed reaches up to 1000 bonds per minute for high-volume production and allows for a reduction in cycle times. It also allows for an integrated wire-bonding of 0.2mm and 0.4mm diameter wires. UTC 1000 SUPER is equipped with a four-axis robot that provides a maximum work area of 370×215×50mm and a maximum joint tension of up to 30kgf. As standard detection methods, the machine includes high accuracy flatness alignment and up-down level alignment of accuracy level of +/- 0.3μm. This allows for precision bonding and enables smaller and finer wire bonds. Furthermore, the machine also supports an electrode pressing and chip-to-chip process as well as a wire flip-chip bonding process. SHINKAWA UTC 1000 SUPER's built-in real-time, online graphical user interface (GUI) allows for quick adjustment of settings and trouble-shooting processes. It also provides a comprehensive monitor and alarm system that allows for real-time monitoring of operations and product data collection. The machine is powered by PC/Windows 8 operating system for easy setup and operation. UTC-1000SUPER supports a wide range of materials such as gold, silver, copper, aluminum, and other wired materials. Overall, UTC-1000 Super is a multi-function automated wire-bonding machine that offers precision and speed for high-volume production of wire bonding products. It's reliable, accurate, and versatile design makes it an invaluable tool for automated wire bonding of many materials and products.