Used SHINKAWA UTC-1000 Super #9302552 for sale

SHINKAWA UTC-1000 Super
Manufacturer
SHINKAWA
Model
UTC-1000 Super
ID: 9302552
Wafer Size: 8"
Vintage: 2007
Wire bonders, 8" 2007 vintage.
SHINKAWA UTC-1000 Super bonder is a state-of-the-art bonding tool for a variety of applications in the electronics industry. It is designed for maximum precision, accuracy and repeatability, making it the perfect tool for assembling, repairing, splicing and cleaning of precision electronic components. SHINKAWA UTC-1000SUPER features a powerful 10-kilowatt laser diode, which delivers thorough, controlled metal and plastic joining without producing any harmful fumes or chemicals. The device can also adjust both up and downslope angles to ensure a superior bond. The high-frequency drive and power supply allow for higher speed and better accuracy than other bonding systems, even when working with sensitive components. The bonder is equipped with a 6-channel work process memory, which allows for repeatable operations, as well as adjustable work process settings for up to 8 joining processes. The device comes equipped with a 15.6 inch capacitive touchscreen display, which provides an intuitive interface for intuitive operation and monitoring of the process. The monitor also displays real-time welding information, and allows for troubleshooting and rapid setup during operation. The unit also features a USB port for external device communication for data transfer and job program design. UTC 1000 SUPER utilizes an innovative modular design concept, allowing for easy servicing and expansion. The system is also CE mark certified, meaning that it is compliant with all necessary health, safety and environmental regulations. The device is capable of joining metals and plastics, and is programmed with 11 different settings to accommodate the different requirements of a variety of applications. Finally, UTC-1000SUPER is a highly efficient device that requires minimal maintenance, and can deliver superior results at a fraction of the cost of comparable bonding systems.
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