Used SHINKAWA UTC-1000S #9242208 for sale

SHINKAWA UTC-1000S is an automated bonding equipment designed specifically for the efficient and accurate handling of an array of substrates in the manufacture of electronic components. The system is designed for fast and precise placement and bonding of small parts such as BGA, BSI, and CSP packages and is well suited for a wide variety of applications, ranging from the ultra-precise manufacturing of high-performance microcircuits to the efficient assembly of more complex components. The unit features an integrated control machine that provides optimised production through the use of real-time control of machine parameters and advanced vision systems. This ensures that no two identical placements can be produced and ensures total accuracy for all substrates. The tool is also highly automated, with virtually no manual intervention required, thus eliminating operator fatigue or variability in production quality. At the heart of UTC-1000S is a high-performance microprocessor and associated multi-axis motor drive. This allows the unit to rapidly move parts within a three-dimensional space, while managing and controlling up to 64 programmable joints. Using feedback from the vision systems, the joint commands can be adjusted to ensure an accurate placement every time. The asset is also fitted with a wide range of bonded parts for a variety of substrates, including BGA, BSI, and CSP packages. This provides a comprehensive range of parts for manufacturing of almost any electronic component. The parts can also be easily exchanged to adapt the model for a wide range of substrates. The design of the equipment also allows for easy cleaning and maintenance, reducing the need for frequent servicing. This, combined with its high production throughput and low operating costs, makes SHINKAWA UTC-1000S an ideal choice for assembly line production.