Used SHINKAWA UTC-200 BI Super #293647033 for sale

SHINKAWA UTC-200 BI Super is a state-of-the-art ultrasonic bonder designed for advanced applications requiring high-precision bonding. It is equipped with unique advanced ultrasonic technology that provides a wide bonding range with minimal impact on part integrity, allowing it to produce bonds with remarkable precision. UTC-200 BI Super is capable of bonding substrates ranging from 0.001" to 0.020" thickness with temperatures up to 200°C. SHINKAWA UTC-200 BI Super's advanced ultrasonic bonding equipment is equipped with numerous features. These include an integrated control system with a built in Ultrasonic Amplitude Control Unit (UACS) for precision programmable bonding parameters, and a high power ultrasonic transducer that produces a wide range of bond frequencies for greater process flexibility and improved efficiency. UTC-200 BI Super also features an auto adjustment machine for instantaneous adjustment of the amplitude for high precision results. This bonder also features a variety of optional features designed to further enhance the user experience. These include a SmoothAngle weld for smooth cut angles, weld program memories for rapid setup, dual suction cups for increased bonding speed, a dual stage press arm for improved bond integrity, a pre-bonding mode for unique part geometry, an adjustable weld time setting, and a post-weld cycle mode for additional protection of the bond integrity. Additionally, SHINKAWA UTC-200 BI Super is designed with an integrated safety tool that goes beyond the basic CE standards to further protect the user. This asset includes a wide array of features such as a self-diagnosis feature for monitoring of the sensors and equipment current status, as well as overheat prevention for improved part safety. In conclusion, UTC-200 BI Super is a high-performance ultrasonic bonder designed for advanced applications requiring maximum precision and stability. Equipped with unique advanced ultrasonic technology and an integrated safety model, it results in improved accuracy and increased safety during the bonding process. Further, enhanced features such as weld memories, adjustable weld time settings, and post-weld cycle modes ensures that the user will have an optimal bonding experience.