Used SHINKAWA UTC-200 BI #293639575 for sale

Manufacturer
SHINKAWA
Model
UTC-200 BI
ID: 293639575
Vintage: 1997
Wire bonder 1997 vintage.
SHINKAWA UTC-200 BI is a fully automated, multi-purpose bonder. It is designed for high-accuracy assembly operations including bonding, soldering, and wire-forming applications. SHINKAWA UTC-200BI has a modern design, with an easy-to-use interface, and its components are integrated into an ergonomic and highly reliable industrial bonder platform. Its main body measures 35 x 35.5 x 27 inches (88.9 x 90.2 x 68.6 cm), and the footprint of the platform is 42.5 x 28.9 inches (108 x 73.3 cm). It has a maximum weight capacity of 40 kg/m2 and a working area of 25.6- by 19.7-inches (65 x 50 cm). To provide precise, accurate assembly operations, UTC 200 BI is equipped with a precise low-noise servo motor-driven equipment, and a high-resolution linear scale. For higher precision, UTC-200BI offers a patented vision recognition system and precise alignment using an up-down slide type. This unit ensures precise assembly positioning. Additionally, to enhance speed and repeatability, the bonder has an auto-bonding mode and a feedback signal capability. The control machine of SHINKAWA UTC 200 BI is highly automated and user-friendly, yet features many customisation options for different types of bonding jobs. It enables the user to easily change between different parameters, such as temperature, speed, pressure, and power. The tool also includes a data memory, which allows for effortless change of preprogrammed settings and quick programming. The bonder has a pneumatically adjustable pressure up to 10 kg/cm² and a temperature range of 50°C to 450°C with two thermocouples and two thermistors. The thermistor also enables an accuracy of 0.1°C. Overall, UTC-200 BI is an advanced, efficient, and reliable bonder that offers precise assembly operations with a highly user-friendly control asset, high-precision vision recognition, and an adjustable temperature range of up to 450°C. It is suitable for various bonding, soldering, and wire-forming operations, and offers enhanced speed, repeatability, and accuracy.
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