Used SHINKAWA UTC-200 BI #293639576 for sale

Manufacturer
SHINKAWA
Model
UTC-200 BI
ID: 293639576
Vintage: 1997
Wire bonder 1997 vintage.
SHINKAWA UTC-200 BI bonder is a fully automated industrial bonding equipment used widely in the electronics and automotive industries. The system is designed for both mounting, soldering and reflowing of all types of components, including both SMD and TH packages, as well as rigid, flexible and rigid/flexible substrates, and modules. SHINKAWA UTC-200BI features an advanced software control unit, enabling it to perform high-speed, precise operations with repeatable, reliable results. The software can control all aspects of the machine, from pre-programmable process parameters and cycle time, to automatic pattern recognition and camera vision for picking and placement accuracy. The tool also has various built-in protection mechanisms for preventing damage to components or substrates during handling. The asset is capable of working with a wide range of component packages and substrates. It has an integrated heater and temperature sensor to ensure accurate and real-time temperature control. It is also capable of variable speed adjustment, enabling the user to customize the process according to the application. UTC 200 BI's integrated camera allows for precise component pick and placement. This feature also helps prevent misalignment and improper placements. The user-friendly interface makes it easy to configure and operate the model, while the high-speed handling capability enables fast cycle times and increased throughput. The equipment's robust design ensures reliable and repeatable results, making it an excellent choice for industrial production. Its integrated safety features, including disconnection detection and component and substrate protection, further enhance its reliability and performance. Additionally, its integrated traceability helps ensure clear accountability for both process parameters and component movement. Overall, UTC-200BI has been designed to deliver high-precision, high-performance operations for various industrial bonding applications. It features a comprehensive set of features to ensure reliable and repeatable results and is backed by an extensive customer service and support network.
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