Used SHINKAWA UTC-200 BI #293647156 for sale

SHINKAWA UTC-200 BI is an advanced, automated vision bonder designed for use by professional electronics companies. This machine provides state-of-the-art bonding for a wide range of applications that require precise connection of two separate components. These include SMT components, flex circuits, modulated wave leads, flat cables, solid die attachments and more. SHINKAWA UTC-200BI provides a number of key benefits: * Three-dimensional vision alignment: This machine uses a 3-dimensional camera to capture and measure the components that need to be bonded and then accurately positions them to ensure accurate bonding. * Speed: UTC 200 BI is capable of bonding speeds up to 350 per hour. * Process Flexibility: This machine has the capability to handle multiple types of payloads across a range of applications. * Advanced Applied Force Monitoring: The equipment is equipped with an advanced applied force monitoring capability that allows for precise control of image quality, speed and precision. This machine also comes with an advanced image capturing system that captures every bonding cycle, using optical microscopy to capture clear and detailed images. This allows for precise inspection as well as optimisation of the bonding process. In addition to this, the machine also provides a range of process tracking tools which are essential for quality management. UTC-200BI is built with an advanced, automated control unit that allows for precise and accurate adjustments to the bonder settings. This machine can also be integrated with any Automated Process Control (APC) software, allowing the customer to control the machine with their own software. This machine offers a number of key safety features including EMI & RFI Protection and a hazardous gas detection machine. This allows for a safe and efficient operation. SHINKAWA UTC 200 BI is the only machine of its kind on the market that can provide the precise, reliable and efficient bonding performance required for a wide range of industry applications. This makes it the perfect choice for any professional electronics company requiring precise, reliable and efficient bonder performance.