Used SHINKAWA UTC-200 BI #9200926 for sale

SHINKAWA UTC-200 BI is a high-precision thermosonic gold bonder and is well suited for applications requiring accurate and precise miniature wire bonding. It incorporates a unique hybrid microprocessor control equipment for optimal performance and reliability. Its gold wire bonding technique creates vibration-free wire bonds with a high degree of accuracy and resolution up to 30μm. SHINKAWA UTC-200BI is equipped with a tachometry-based ball shear head, which contributes to higher batch speed and enhanced accuracy. It features an adjustable slave head for more precise production runs and a high-performance wire feeder for increased productivity. With its high-speed wire loop control and powerful ball shear head, UTC 200 BI can easily perform multiple bonding tasks. The pre-heat temperature control system ensures consistent temperatures throughout the production process, and the external vacuum unit ensures efficient heat removal for optimal bond integrity. UTC-200BI has a robust single or dual-axis bond head, offering a range of maximum traveling speeds up to 350mm/sec. Additionally, the bond heads are supported by a tilt mechanism that allows fine adjustment of the bond site, further contributing to the machine's accuracy and efficiency. The thermo-sonic bonding technique offers distortion and stringing prevention for a cleaner, more efficient final product. UTC-200 BI also features an intuitive HMI for easy setup and clear process information. PLC interface enables integration into automated systems. SHINKAWA UTC 200 BI is the ideal choice for assemblies requiring precision gold wire bonding. Capable of providing high quality connections, the machine is designed to reduce scrap and improve yields. Its fast looping and shearing performance, as well as its wide range of customization abilities, make it a perfect fit for even the most demanding miniature gold wire bonding applications.