Used SHINKAWA UTC-200 BI #9208423 for sale

SHINKAWA UTC-200 BI is a revolutionary ultrasonic bonder that is designed for the efficient bonding of a variety of materials including metals, plastics, and fabrics. It is capable of doing high-speed, high-precision bonding and has a wide range of compatible materials and bonding patterns. SHINKAWA UTC-200BI has a vision-guided charting equipment with auto-mode detection which uses advanced technology to monitor the position of welding lines. This helps to reduce setup time and maintain accuracy while bonding. It also features two-dimensional automatic compression control that allows for precise adjustments of the welded area. Plus, dynamic pitch control adjusts the amplitude during welding, ensuring no breakouts in the line. One of the remarkable features of UTC 200 BI is its ultra-short bonding time of only 0.04 seconds. This also helps to reduce setup time and production costs. Additionally, the robust, full-fledged automation system allows for easy and efficient bonding on large scale through multi-head operation. UTC-200 BI has a dual-axis control unit with two-way thermal control, which helps to improve repeatability and accuracy. Its incision control machine secures the periphery of the material, preventing distortion. The bonder is also highly versatile, with adjustable parameters such as focusing distance, peak power, and frequency. Plus, it is equipped with an in-line internal view camera that allows for precise alignment of the materials. SHINKAWA UTC 200 BI is also equipped with a user-friendly interface allowing for data input, data management, and diagnostics for optimized production. Quality management is also ensured with advanced functions such as flow monitoring and defect detection. With its compact design and small footprint, it has a low installation cost and can fit into the smallest of spaces. Overall, UTC-200BI is a versatile, powerful bonder that is designed to make your bonding process efficient and cost-effective. Its advanced technology and compact design make it ideal for a range of high-precision bonding needs.