Used SHINKAWA UTC-200 BI #9352201 for sale

SHINKAWA UTC-200 BI Bonder is an ultrasonic bonding equipment specifically designed for lab operations, as well as large-scale production lines. It measures small pieces of metal with a millimeter accuracy. This precision is achieved with the use of patented technology such as the high speed synchronous drive system in conjunction with a stage that moves smoothly and quickly. SHINKAWA UTC-200BI can be used for a wide variety of bonding applications, such as the bonding of leads, cables, grounded and non-shielded wires, and can also be used for pressing, splicing, and braiding processes. The UTC-200 can be easily controlled with a computer interface, which allows for operators to set parameters such as bonding speed, and waveform. The models can also be configured with an automatic offset compensation feature, which corrects for misalignments between components. Additionally, UTC 200 BI has a data saving feature, which can save up to five recipe settings and automatically recall them for future use. There is also a stage motion monitoring unit that continuously monitors the stage during operation, and prevents any misalignment of the workpiece to the force unit, this ensures that all pieces are evenly bonded. UTC-200 BI also contains a functional self-diagnosis machine, which can detect errors within the machine and pinpoint to the exact component at a glance. Furthermore, the ultrasonic tool is designed to allow continuous operation over extended periods, minimising maintenance and downtime required for the asset. With its dust prevention feature, it prevents dust entry, which in turn makes repairs much simpler. SHINKAWA UTC 200 BI ultrasonic bonding model is a highly accurate and reliable equipment, which offers flexibility and accuracy, and can bond narrow pieces and large chunks of metal parts with outstanding speed and consistency. It is ideal for laboratories and production lines, and can easily be controlled and monitored to ensure that a reliable and quality bonding process is achieved.