Used SHINKAWA UTC-2000 Super #293659097 for sale

SHINKAWA UTC-2000 Ultra Thin Bonding (UTB) machine is an advanced, multi-function bonding platform designed to perform sophisticated bonding and protection for environment-sensitive electronic devices. Utilising a unique combination of features and technology, the UTB can accurately bond and protect a wide range of materials in a single operation allowing for faster processing speeds and improved accuracy in complex processes. The UTB is designed to perform ultra-thin (0.1 micron to 1.5 micron) bonding applications with the capability to bond, shape, protect and insulate a variety of materials including metals, semiconductors, passives, optical and electro-optical parts, and other thinly coated materials. Its precision control and accurate results minimise the need to take multiple measurements in complex applications. The on-board image processing capability helps to quickly identify and address any stray particles or misalignments. This highly versatile platform provides high precision control over the bond process via a wide range of advanced features. These include automated scanning, on-board data storage, sequence editing, and a high-resolution touchscreen. These technologies allow for precise process control and improved productivity while also reducing labour costs. The UTB is also equipped with the latest in solidify material technology - a patent-pending method of affixing thin materials to a substrate without the need of adhesives or epoxies. It provides a cost-effective alternative that eliminates lost particles and reduces contamination and deformation. The UTB also provides users with the ability to bond up to four different lamination materials in a single operation. This increases efficiency and accuracy in complex applications while reducing the cost associated with multi-step application processes. The UTB incorporates an advanced dual action laser and sputter chamber for superior performance. This dual-action feature allows users to achieve precision and accuracy in a fraction of the time normally required on manual systems. The UTB is the ultimate tool for advanced, affordable, and environmentally friendly electronic packaging solutions. Its compact design, robust construction, and advanced technological features make it the ideal choice for a range of applications, including automotive, aerospace, telecommunications, medical, optoelectronics, consumer electronics, and more.