Used SHINKAWA UTC-2000 Super #293659098 for sale

SHINKAWA UTC-2000 Super is an all electric automatic wire bonder for semiconductor device packaging. Built from SHINKAWA commercial off-the-shelf components, this bonder provides a reliable, high-speed solution for die attach and wire bonding applications. SHINKAWA UTC2000 SUPER includes an integrated vision equipment to accurately align the parts for placement. This system uses an X/Y stage with high-resolution encoders to accurately position each part prior to bonding. The bonder has 32 fully programmable pattern storage with up to 8 conditions. The operation of the bonder is controlled through a highly advanced microprocessor and a touch panel LCD interface. The LCD allows the operator to program the bond parameters, view product data, and set adjustment parameters. The bonder is capable of handling 1.25 to 12.0 mil diameter aluminum wires and can bond at a maximum wire bonding speed of 10,000 bonding heads/second. UTC-2000SUPER features an all-electric drive unit that can be pneumatic or electropneumatic, along with automatic gold wire cleaning. The bonder also includes an automatic adjustable ultrasonic head with Gold Wire Feeder technology and a Wafer Inspection Machine. The ultra-fine pitch technology allows for 12 wire bonds per die attach with an industry leading 0.5mil pitch. This bonder also uses a unique patended heat-sink technology to control the temperature and to ensure repeatability of high-quality bonds. UTC 2000 SUPER is an ideal bonder for a variety of bonding applications such as stacked die, wire bonding, thick film, chip on tape, and tape bumping. It offers a reliable solution for quality die attach and wire bonding applications and is designed for maximum productivity and efficiency. The advanced technology improves the performance of both die attach and wire bonding processes in a matter of seconds.