Used SHINKAWA UTC-2000 Super #9156127 for sale

SHINKAWA UTC-2000 Super is an ultra-precision, fully automated, and high-throughput wire bonder designed for a wide range of thermocompression, ultrasonic and thermosonic bonding processes. With its single-wheel design, it can perform up to 100 bonds per second with unparalleled accuracy and minimal handling time. SHINKAWA UTC2000 SUPER is capable of handling very small, delicate wire sizes, from 0.1mm to 0.7mm, and provides precise control over the bond parameters, allowing it to produce highly reliable results. Its advanced features include automated wire cleaning, an automated alignment system for aligning and balancing wire bonds, and a high-powered automatic bonding tool vibrator for accurate bonding. In addition, UTC-2000SUPER is equipped with a powerful thermal imaging system to detect defective bonds and optimize wire bonding processes, as well as a high-precision vision system to ensure the accuracy of the bond formation. SHINKAWA UTC 2000 SUPER is highly effective in both leadframe and die bond processes, thanks to its ability to bond all type of surfaces, including gold, aluminum, copper, and many others. Its robust design provides enhanced durability, enabling it to work in demanding and hostile environments. In addition, the machine has an integrated bonding station with a fast-acting heating element for quickly controlling changes in temperature and wire size, as well as an adjustable force control for improved repeatability and accuracy. Furthermore, the machine includes a patented contamination-resistant wire-bonding head for longer service life and improved accuracy. UTC 2000 SUPER is designed to maximize efficiency and accuracy while reducing production costs and waste. It is easy to use, highly productive, and reliable, making it the perfect choice for mass production and high-precision assembly tasks.