Used SHINKAWA UTC-2000 Super #9165503 for sale

SHINKAWA UTC-2000 Super is a fully automated bonder used in precision electronics assembly. This state-of-the-art machine ensures consistently high-quality bonding and a long service life. Utilizing precision motion control and advanced imaging technology, the machine accurately positions and bonds components to the substrate with complete control over preheat, heat, pressure, and speed. SHINKAWA UTC2000 SUPER has a wide working range, allowing it to bond to work pieces from 0.2 mm to 500 mm. It can be used to bond different types of leaded components, including QFP, transistor, chip, bare chips, chip resistors, chip capacitors, and various other lead form types. It has two bonding methods: Thermo-compression and Thermo-ultrasonic bonding. It has an excellent vibration waveform optimization function, which enables the machine to accurately adjust the vibration parameters of the bonding tool in order to achieve the desired result. The machine also has advanced image recognition capabilities, enabling it to evaluate the quality of the bonding process with real-time feedback. The machine is equipped with three cameras for capturing high-resolution images of the bonding process, as well as automated zoom and focus capabilities. The equipment also has an integrated data analyzer, allowing it to recognize any potential defects and alert the operator. UTC-2000SUPER also features a cutting edge automated loading and unloading system that minimizes the need for manual handling. This provides accuracy and convenience while reducing fatigue and injuries for operators. Additionally, the machine is equipped with a production line optimization unit, allowing it to adjust its performance levels to meet particular needs. By combining advanced motion control, superior imaging capabilities, and a production line optimization machine, SHINKAWA UTC 2000 SUPER offers the best in precision electronics assembly. It is fast, accurate, and reliable, making it an ideal choice for a variety of applications.