Used SHINKAWA UTC-2000 Super #9208250 for sale

SHINKAWA UTC-2000 Super is an ultra thin wire bonder designed specifically for small, dense components. This manual thermosonic bonder features quick setup and accuracy with a lightweight design, making it ideal for precision wire bonding in applications where space is an issue. SHINKAWA UTC2000 SUPER has powerful built-in software and hardware for advanced control, allowing for precise, effective, and repeatable ultrasonic microwelding of wire connecting two electronic components. This system features a stable design with both temperature control and air pressure regulators that ensure accuracy and consistency. Its features include an optional foot switch for a user-defined operator workstation, a 10-motor drive system for fast and accurate movements, a 20um laser spot monitor for optimized performance, and automatic bonding capabilities. UTC-2000SUPER also has a variety of tooling options for precise placement and an anti-baffle spring for wire tension control. Its user-friendly software, along with its wide selection of tip shapes and sizes, allows users to easily customize the wire bonding parameters and create their own specialized packages. It also includes a process verification and productivity monitoring system to ensure high production yields. SHINKAWA UTC-2000SUPER offers superior bond lifetime performance, especially in smaller package sizes. This wire bonder has been tested and approved by manufacturers for various applications such as interconnects and substrates. With its low thermal mass and small footpsrint, UTC 2000 SUPER is an ideal choice for anyone looking to maximize packaging density while minimizing costs.