Used SHINKAWA UTC-2000 Super #9249983 for sale

SHINKAWA UTC-2000 Super is an advanced process bonder with automatic wire bonding capability. It is a fully automated equipment that is designed to meet the demanding requirements of advanced device packaging and lead free wire bonding. SHINKAWA UTC2000 SUPER uses a specialized machining process called ultrasonic wedge bonding to form connections between an electronic component and a lead frame. This form of bond is ideal for attaching heavy leads to small leads, without compromising the integrity of the connection. UTC-2000SUPER features a powerful processing unit which utilizes a high-speed, multi-axis motor control system. This allows for high-precision, fast-feed operations and an advanced auto-threading and auto-feeding mechanism. The unit is equipped with several control modules, including a powerful optical alignment unit and a durable auxiliary frame to ensure stable and smooth working environment. The machine is also equipped with an auto-jigging positioning machine which allows for precise and repeatable positioning of the bonder heads. UTC-2000 Super is designed to handle a variety of materials, from aluminum, copper, platinum or titanium to various epoxy materials. The machine is designed for high-precision bonding which ensures a precise and reliable connection. It also has several safety features such as pressure-sensitive safety stop and emergency stop tool. UTC2000 SUPER has numerous advantages over traditional bonding techniques. It is able to provide a greater degree of accuracy and control in the process, and also allows for very high bonding speeds. Furthermore, the unit is able to provide a high degree of process consistency and repeatability, especially when compared to manual methods. This makes it an ideal machine for large-scale production lines. SHINKAWA UTC-2000SUPER is a highly efficient and reliable bonder, which is suitable for a variety of high-precision applications. It is designed with features such as an ultasonic wedge bonding asset, a powerful optical alignment model, an auxiliary frame, and auto-jigging positioning to ensure that the quality of the bond is consistently maintained. It is also highly economical, making it an ideal machine for high-volume manufacturers.