Used SHINKAWA UTC-2000 Super #9263939 for sale

SHINKAWA UTC-2000 Super Bonder is an automated wire bonder ideal for medium to high production volume or specialty applications. It features a high accuracy and full range of wire looping capabilities that provide superior wire bonding performance. Its advanced hardware and software permits higher levels of output through shorter cycle times resulting in excellent longevity and reliability. SHINKAWA UTC2000 SUPER offers an innovative dual head equipment with a choice of two head configurations, allowing simultaneous bonding in both the ball and wedge modes. With this system, the operator can easily switch between two different bonding techniques ranging from multi-layer row bonding to mass production of aluminum wire for flip chip assembly. UTC-2000SUPER utilizes a single, fully integrated main control unit that houses primary components including the power supply, weld digital control board, and a stepper motor precision actuator. Other features include adjustable welding energy and current, selectable in-line handling patterns for both ball and wedge bonds, programmable parameters for spot size control, and continuous wire feed adjustment. The unit also includes a user-friendly Windows interface, a comprehensive diagnostics package, and process monitoring and tracking functions. SHINKAWA UTC 2000 SUPER's flexible design features a wide range of wire sizes and shapes, allowing users to bond wire as small as 0.0004 inches in diameter. Its 'zoned' workstation allows the user to quickly change part location without changing orientations. The bonder also has the ability to utilize a variety of wire sizes at different pitches, such as board-to-board, board-to-device, and chip-to-device packages. The unique, simultaneous pick-up capability greatly reduces cycle times. Designed to be user-friendly, SHINKAWA UTC-2000SUPER features a 3D motion control machine for precise wire handling and video capability for setup verification and quality assurance. The chart plotter feature allows the user to monitor in real-time the entire process from bonding start to finish. The tool also includes a feed monitoring and alarm feature with adjustable tolerances to minimize operator errors. UTC 2000 SUPER is an ideal platform for assembly and packaging applications, with a wide range of bonding capabilities and a sturdy construction. The asset allows users to create high-quality products quickly and reliably, making it the perfect solution for reliable, cost-effective manufacturing.