Used SHINKAWA UTC-2000 Super #9303549 for sale

SHINKAWA UTC-2000 Super is an advanced fully automated bonder equipment which offers users a wide range of customization when it comes to bonding and wire soldering. It utilizes a dual-head wafer and strip bonder for precise and accurate operations. SHINKAWA UTC2000 SUPER has a straight bounder option which enables texturing and dimpling on wires through the application of multiple bonding heads. The system can also be used for angled wire bonding and wedge bonding and the available bond head can be switched rapidly to suit different wafer conditions and layer types. UTC-2000SUPER features an adjustable heat source and also offers enhanced accuracy and repeatability. The unique CCD unit built into the bonder allows for precise alignment of the bond head and eliminating errors from double-stripped wire. This machine also allows users to customized soldering parameters to match the wire size, material, and type. SHINKAWA UTC 2000 SUPER can be used to bond both ball and ribbon bonds as well as fuel cell connections, display panel connectors, and other precision components. The tool is equipped with a user-friendly control panel which provides users with a detailed overview of the parameters for the bonding processes. UTC 2000 SUPER offers high-precision bonding at speeds up to 4000 stitches per hour, and higher speeds can be achieved in simple wire bonding operations. The use of consumable wire or ribbon spools ensures greater efficiency, and the asset also has a built-in wire crimping mechanism. Overall, SHINKAWA UTC-2000SUPER offers users a comprehensive range of bonding and welding solutions with superior accuracy. The built-in CCD model ensures precise alignment of the bond head while the user-friendly control panel provides an easy-to-use interface that allows for quick setup and adjustment of the parameters. The ability to quickly switch between types of bonds, texturing, and dimpling makes the equipment ideal for a wide range of applications.