Used SHINKAWA UTC-2000 Super #9304779 for sale

SHINKAWA UTC-2000 Super is an advanced and reliable bonder designed for the challenging applications in the modern manufacturing environment. The bonder is designed for use in a variety of substrates, including extremely fine flat or contoured surfaces, and can be used for a wide range of applications, from thin and thick substrates to micro-assembly and PCBs. SHINKAWA UTC2000 SUPER's main feature is its highly precise placement on the substrates. Thanks to an advanced wobbler mechanism, the bonder is able to precisely place a thin layer of adhesive onto the substrate without breaking, regardless of the type of substrate used. Furthermore, the bonder is equipped with a unique dripless applicator which facilitates a more consistent application of the adhesive and prevents waste of material. UTC-2000SUPER is a fully automated bonder, with an easy-to-use user interface that allows simple operation and setting of parameters for quick and accurate bonding results. To ensure that the bonder is kept running at peak efficiency, SHINKAWA UTC 2000 SUPER is also equipped with a maintenance free design and self-diagnostics system that monitors its performance and reports any errors or malfunctions. Furthermore, UTC 2000 SUPER is a thermocompression bonder, capable of bonding even delicate substrates void of any residue or scorching. The bonder is equipped with user-definable parameters such as bonding force, temperature and release time, for optimum bond-to-substrate adhesion. In addition to its advanced featur