Used SHINKAWA UTC-2000 Super #9304781 for sale

Manufacturer
SHINKAWA
Model
UTC-2000 Super
ID: 9304781
Vintage: 2007
Wire bonder 2007 vintage.
SHINKAWA UTC-2000 Super is a powerful bonder for a variety of applications, offering advanced features and robust performance. It is a high-performance, multi-function bonding solution with ease of use and reliability. The electrical contact bonding system utilizes a unique, opto-mechanical control system to ensure high-quality, precise, and repeatable bonds. This is accomplished using a 5-axis Unified Worktable with a full range of motion, a three-axis bonding arm, and several control strategies to ensure optimal bonding. SHINKAWA UTC2000 SUPER offers the same excellent bonding techniques as previous models, such as advanced hot bar lid bonding, and ultrasonic, soldering, and thermosonic bonding. High performance bonding operations are achieved with high repeatability and minimal operator's intervention. This unit also offers high-precision thermal control, allowing for precise temperature measurement calculations and high-speed temperature measurement. In addition, UTC-2000SUPER also offers high-strength and accurate hermetic sealing of stacked chips, as well as fast and reliable 3D digital interconnection of printed and stacked substrates. This unit also features advanced stability, as well as accelerated probes for bonding and inspection. SHINKAWA UTC-2000SUPER is highly efficient and cost-effective, with a low operating temperature and low power consumption. With a specially designed UL approved power supply, this unit is certified for safety. Furthermore, SHINKAWA UTC 2000 SUPER contains guaranteed quality hardware and software components, with continuous support from SHINKAWA. This ensures the unit will remain in excellent condition over a long lifespan. All these features make UTC-2000 Super an invaluable device for any bonding process. With its advanced features, superior performance, and availability of support, this versatile bonder offers a strong, reliable solution for any application.
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