Used SHINKAWA UTC-2000 Super #9304782 for sale

SHINKAWA UTC-2000 Super is a high-performance ultra-precision bonder designed for use in the semiconductor and microelectronic industries. This device features an advanced design that combines sophisticated optics, dual sided alignment, and an accurate multi-axis vision equipment. With a wide processing area and a large working envelope, SHINKAWA UTC2000 SUPER is capable of effectively bonding components of up to 0.15mm size with a maximum accuracy of 20 μm. UTC-2000SUPER utilizes a CCD-camera that is able to measure and detect a wide range of bond parameters. The device features a high-speed, high accuracy and high resolution vision system that guarantees exact bond alignment and reproducible results. With a precision control unit that allows for fast transition between bond parameters and bond sites, UTC 2000 SUPER increases the productivity of the bonding process. The device further features a and color LED ring-light that eliminates flicker and boosts the brightness and color resolution. It uses a high-speed, high-resolution camera machine capable of detecting bond parameters across a wide range of positional and azimuthal rotation. What's more, SHINKAWA UTC-2000SUPER has a fully automated operation mode for high volume production. The quickly adjustable tool is also equipped with an intuitive user interface and data collection within an integrated asset. It supports multi-axis displays, 3D CAD data and a variety of BGA and CSP component types. UTC2000 SUPER offers outstanding quality performance and flexibility with a variety of component and pad size options. Its easy operation with high productivity makes it ideal for production bonding processes. With advanced control and accuracy, this device offers superior precision and dependable results. UTC-2000 Super also offers advanced monitoring with trouble diagnosis, process flexibility, and a range of component processing options, making it the ideal bonder for more advanced applications.