Used SHINKAWA UTC-2000 Super #9404240 for sale

SHINKAWA UTC-2000 Super is an advanced and highly reliable precision bonder. Its versatile design makes it suitable for both mass production and research and development. The bonder is made from stainless steel components and is equipped with a user-friendly, GUI-based operation system. SHINKAWA UTC2000 SUPER is a high-speed bonder with load speed, bond speed, and unbond speed all adjustable. Heat sinking, temperature control, and other temperature generating characteristics can be controlled to within 0.1°C. The large-size LCD (10.4 inch) display is used to facilitate easy setting and stable operation on either single-piece or batch production. UTC-2000SUPER features a nozzle with a puck patterning system which is ideal for devices that require high adhesion. The nozzle is made of tungsten, molybdenum, and titanium which help ensure a high level of durability even under harsh conditions. UTC2000 SUPER includes an integrated auto loader mechanism for quick and efficient loading and unloading. The auto loader is equipped with a built-in processor to control production speed and accuracy. The device is capable of simultaneously handling multiple bonding and loading operations and has a maximum driving force of 2.3N. The ultra-fast laser scanning mirror provides superior accuracy thanks to its high-speed positioning. Along with the shutter which helps to prevent material waste, the laser scanning feature allows for precise adhesion of bonded materials. SHINKAWA UTC-2000SUPER is a top-of-the-line bonder designed to meet the rigorous demands of today's bonding tasks. It is ideal for a variety of applications, such as semiconductor packaging, flat panel displays, and LEDs. With its array of features, UTC 2000 SUPER provides an economical yet reliable solution for error-free and efficient bonding.