Used SHINKAWA UTC-2000 #293604539 for sale

SHINKAWA UTC-2000 is a bonder designed for the semiconductor industry. It is an advanced, precision tool that can be used to perform a range of bonding operations, from advanced flip-chip assembly to simple wire bonding. SHINKAWA UTC 2000 is built with durability in mind and offers superior performance and reliability. UTC-2000 features an independent, advanced, binary optics equipment. This is used to achieve improved accuracy and repeatability, even when working with the most challenging bonding operations. The advanced optics system is also adjustable to different x-y axes, allowing the user to easily adjust the optics unit to the desired point of operation. The bonder is also equipped with a high speed, main motor to ensure operation is as fast and efficient as possible. The main motor offers a variety of bonding speeds, including very low and very high speed settings. With the ability to bond a wide range of materials, the main motor is able to achieve a variety of bonding operations, including advanced copper wire bonding. UTC 2000 also features an advanced software machine. This makes it possible for the machine to quickly and accurately read and control the operation. With the ability to control the parameters of the operation, the software tool ensures that the operation is performed with the highest accuracy. In order to further improve operation, the bonder also includes a low-glare optical asset. This allows the user to easily capture clear images of the bond operation, even in challenging lighting conditions. Additionally, the model is also equipped with a winding machine to ensure wire bonding is performed accurately and quickly. Finally, SHINKAWA UTC-2000 also features an advanced safety equipment. This system is designed to ensure that the machine is used properly and in a safe working environment. With the built-in safety features, the bonder is able to produce consistently high quality results with maximum efficiency.