Used SHINKAWA UTC-2000 #293604709 for sale

SHINKAWA UTC-2000 ultra-thin low-temperature bonder is a high-performance wire-bonding machine designed for end-to-end production of ultra-thin semiconductor packages. SHINKAWA UTC 2000 uses a three-zone oven to apply 150um-thick polymer tapes to achieve laser power delivery of 0.3W/mm2. The heated roller system minimizes thermal risk to provide reliable low-temperature bonding. The unit is compatible with a range of high-volume Wire Bonding Sizes and heats seals thin film packages with a 0.4mm pitch. UTC-2000 offers efficient and precise wiring at an amazing rate of speed. The servo-motor control technology ensures accurate wire threading and placement, making it capable of achieving a bond pitch as thin as 0.2mm. The unit's main shaft adopts a high-precision ball screw positioning system, as well as a powerful noise reduction mechanism and point-of-load servo motor to ensure that long-term cycle time is consistent. UTC 2000 provides a high degree of precision through its 4-axis servo controlled movement. The unit allows for smooth and precise maintenance of the wire alignment. In addition to the already high-precision control, the unit comes with an automated wire measuring function, as well as a vision system for precise and accurate positioning. SHINKAWA UTC-2000 features a number of features designed to increase its reliability and safety, including image processing and an auto calibration for the wire alignment that reduces the possibility of wire fatigue caused by frequent misalignment. The unit can be used for a range of applications, including flip chips, lead frames, CSPs, and WLCSPs. SHINKAWA UTC 2000 is a highly reliable and efficient wire bonder, designed for use in production of ultra-thin semiconductor packages, saving electrical engineers time and money. The unit is capable of controlling both temperature and wire alignment with high precision and flexibility, as well as being extremely durable and safe.