Used SHINKAWA UTC-2000 #293605141 for sale

SHINKAWA UTC-2000 is a state-of-the-art ultrasonic thermosonic bonder that is used for a wide range of microconnectivity bonding applications. It is designed to provide precision and reliability during the entire bonding process, from start to finish. SHINKAWA UTC 2000 features automatic wafer feed, soldering, and welding capabilities, making it ideal for both large-scale and small-scale production runs. UTC-2000 bonder utilizes ultrasonic technology to create highly reliable bonds between ASICs and substrates. This technology uses sound waves to create tiny vibrations that bond the components in place without causing damage. The high frequency of the sound waves creates an energy-efficient and compact bond that is highly reliable and accurate. UTC 2000 bonder utilizes various temperature settings to ensure optimal bond strength. The machine is capable of reaching temperatures up to 500° Celsius, allowing it to bond components of both low and high temperatures. Additionally, SHINKAWA UTC-2000 boasts a fast bonding speed that enables quick and easy bonding of components. This feature is especially useful in high-volume production scenarios. SHINKAWA UTC 2000 offers a user-friendly interface that makes it simple to control the machine. This includes a LED display and a touchpad that allows for easy setting of parameters and selection of bonding options. Furthermore, the machine is capable of storing up to 30 programs, giving operators the ability to save multiple preset settings for fast selection of desired bonding options. In addition to its advanced features, UTC-2000 also provides reliable safety features to protect the operator from potential hazards. This includes an Auto-Cutoff switch that halts the machine during certain scenarios, such as a stuck wafer or over-heating of the components. In addition, UTC 2000 includes a sound proof enclosure to prevent excessive noise levels in an operational environment. Overall, SHINKAWA UTC-2000 ultrasonic thermosonic bonder is an advanced and reliable machine that is designed to provide fast and efficient connections between substrates and ASICs. With its user-friendly interface, high temperature settings, and protective safety features, SHINKAWA UTC 2000 is an ideal device for a variety of microconnectivity bonding applications.