Used SHINKAWA UTC-2000 #293615054 for sale

SHINKAWA UTC-2000
Manufacturer
SHINKAWA
Model
UTC-2000
ID: 293615054
Vintage: 2007
Wire bonders 2007 vintage.
SHINKAWA UTC-2000 is a state-of-the-art, stand-alone automated thermal bonder. This advanced and reliable machine features a low thermal bonding cycle time, and is capable of producing even and consistent bonds over a wide variety of materials and substrates. SHINKAWA UTC 2000 boasts a fast thermal bonding pattern setup and an accurate thermal bond pattern control through the use of a digital thermal shape sensor, computer numerical control (CNC) software and a Graphical Interface. It also comes with a user-friendly touch screen control panel with an intuitive graphical interface, which makes it easy to set up and manage bonding patterns. UTC-2000 is designed to be an all-in-one solution for thermal bonding applications, offering high quality, consistent bonding results and low energy consumption. Its thermal bonding head adopts an advanced dual-pressure system, which ensures an even distribution of heat and pressure. This system enables UTC 2000 to create perfect micro-structures and maintains a uniform, tight bond. The machine also features integrated built-in cooling, allowing users to quickly cool down the bonding process to prevent material distortion. In addition, SHINKAWA UTC-2000 is equipped with several features specifically designed to achieve high quality bonding results. It features advanced temperature control that continually measures and monitors surface temperatures, ensuring the reliable and consistent thermal bonding of materials. The integrated vision system also enables users to record images of bonded components and display them for comparison and quality control. SHINKAWA UTC 2000 also stands out for its safety features, which include an automatic lockout when the operator leaves the control area and an automatic self-test routine that inspects the machine upon startup. Its user-friendly touch screen control panel offers a simple and intuitive way to set parameters and review performance data, while the unit's enhanced support function makes it easy to troubleshoot in case of problems. Overall, UTC-2000 is an ideal solution for thermal bonding applications that require consistent bonding results and low energy consumption. Thanks to its reliable performance, efficient design and user-friendly interface, this automated thermal bonder is capable of helping users achieve excellence in thermal bonding.
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