Used SHINKAWA UTC-2000 #9217491 for sale

SHINKAWA UTC-2000 bonder is a top of the line equipment used to bond metals and other materials together. With its precision soldering capabilities, SHINKAWA UTC 2000 can facilitate precision joining of a variety of materials and create electronic interconnects, sealants, and other types of adhesive bonds. It is an ideal tool for applications in the medical, automotive, and electronic industries. UTC-2000 is equipped with a 9 kW, three-phase power supply, and provides a maximum contacting speed of up to 10 m/min. This makes it highly efficient for typical bonding processes such as soldering, brazing, welding, and staking. The bonder also has a number of features that provide greater control over what is being bonded. These features include a fireproof ceramic tip, adjustable temperature control, and a wide range of pulse widths, making it versatile and globally applicable. In order to ensure user safety, UTC 2000 is designed with a high degree of EMI/RFI shielding, meaning that any operations involving the bonding are safe from potential interference from outside sources. Additionally, this device has a welding circuit control equipment and self-test system to automatically detect any potential malfunctions or problems before beginning the process. SHINKAWA UTC-2000 also comes with an in-process monitoring unit that can monitor each stage of the bonding process. This allows the user to continually monitor the entire process in real time, ensuring a precise bond. The bonder can also be used in conjunction with a laser vision machine to thoroughly inspect workpieces for defects in order to ensure quality. SHINKAWA UTC 2000 ultimately provides users with a highly accurate and reliable way to perform precision bonding applications quickly and efficiently. With its broad range of features, the bonder is a great addition to any metalworking company.