Used SHINKAWA UTC-2000 #9236421 for sale

SHINKAWA UTC-2000 is a state-of-the-art automated thermosonic bonding machine manufactured by SHINKAWA, designed for assembling semiconductor components. The machine has a vacuum casting platform for providing a low-stress bonding environment that effectively minimizes voids, cracks, and other imperfections. SHINKAWA UTC 2000 also features advanced process control technology, maintenance-free operations, and a maximum bonding speed of 3.2 ms. UTC-2000 is equipped with a highly sophisticated system of sensors and cameras, which allows the machine to accurately measure the quality of processes such as ball-bonding and die attach. The machine has a maximum bonding force of 500 N, allowing it to achieve the highest ball-bonding accuracy in the industry. UTC 2000 also features a flexible system of rollers, allowing it to easily switch between different types of substrates. These can be coated copper, copper-clad aluminum, polyimide, polyester, and polyolefins. SHINKAWA UTC-2000 features an easy-to-use graphical user interface (GUI), which allows users to monitor the process from a central control station. The machine can also be programmed to run a variety of production processes, allowing manufacturers to make real-time adjustments to increase throughput and reduce material costs. In addition to its high performance, SHINKAWA UTC 2000 is highly reliable. Its tough build quality and rigid frame construction render it highly resistant to changes in temperature, vibration, and shock. It also features built-in shock absorbers and robust ball-bonding assemblies, which ensure that components are not damaged during bonding. All in all, UTC-2000 is a highly advanced automated thermosonic bonding machine, ideal for producing high-quality substrates for the semiconductor industry. Its sophisticated process control technology, maintenance-free operations, and robust build quality make it an ideal solution for a variety of manufacturing applications.