Used SHINKAWA UTC-2000 #9254535 for sale

SHINKAWA UTC-2000 bonder is a full-featured, fully automated equipment used for quick and precise bonding of small components. It is ideal for use in microelectronics, including semiconductor packing and other delicate packaging tasks. The bonder utilizes a newly-developed ultra-precise pre-alignment system to ensure accurate product feed and delivery, and it is equipped with a high-performance vision unit to easily detect and correct any alignment errors. SHINKAWA UTC 2000 bonder is equipped with two high-speed bonding heads capable of working together or separately. The ultra-precise pre-alignment machine can detect errors in plane height and component alignments down to micrometer levels, allowing for more accurate and reliable bonding operations. The main control tool of the bonder has a user-friendly interface that allows fine-tuning of settings such as bond force and precision alignment. This allows the user to quickly change settings and easily adapt to different component sizes and shapes. The bonder has a built-in camera asset to monitor the bonding process for real-time quality control. The camera model also records bonding data, enabling the user to quickly and easily track and analyze the success rate of different bonding operations. UTC-2000 bonder is fully compatible with a range of accessories, which add capabilities such as temperature and motor speed adjustment and external operation. UTC 2000 bonder is capable of performing high precision bonding tasks with a low failure rate. It is versatile enough to be used in different production lines and for a wide range of components. The user-friendly control equipment allows quick and easy setting adjustments, and the inbuilt detection and recording systems provide data which helps to optimize production processes. All of these features make SHINKAWA UTC-2000 bonder an ideal choice for high-quality, fast, and reliable bonding operations.