Used SHINKAWA UTC-2000 #9263941 for sale

SHINKAWA UTC-2000 is a state-of-the-art wafer bonder designed to achieve reliable flip-chip die-to-substrate or die-to-die bonding. In flip-chip bonding, wafers are micro fabricated to create a three-dimensional semiconductor device with metal interconnects on its surface. This process can be used to produce a number of circuits, making it attractive for a wide range of applications. SHINKAWA UTC 2000 is capable of handling wafers up to 200mm, and is quickly becoming the preferred solution for flip-chip die packaging. UTC-2000 features an advanced five-axis alignment equipment, with a maximum accuracy of 1µm. This allows for precise alignment of die-to-substrate and die-to-die bonds, ensuring optimal performance when producing devices with small-scale features. In addition, the bonder has an automated heat and force control system, which ensures each bond is tight and secure without risking any damage to the fragile wafer. UTC 2000 also offers a variety of bonding methods, including thermo-compression, eutectic and anisotropic conductive adhesives. It can also handle a wide range of materials, including silicon, quartz, ceramics, gold, aluminum, and copper. All of these features make SHINKAWA UTC-2000 ideal for a variety of applications, from high-density memory chips to radio-frequency integrated circuit devices. SHINKAWA UTC 2000 is designed for compatibility with standard fume hoods, as well as industry-standard electrodes and vision systems. Its enclosure also features stain-resistant coating, making it easy to clean and maintain. And with its multi-functional button pad, the bonder can be programmed to suit individual applications. To ensure that UTC-2000 operates safely, SHINKAWA has equipped the device with a safety interlock and emergency stop features. The bonder also has a two-tier certification unit, with the upper level being applicable for clean rooms and laboratories, both of which are used for die and wafer fabrication. UTC 2000 is an ideal solution for modern integrated circuits. With its advanced five-axis alignment machine, automated heat and force control, and variety of bonding methods, it provides high-precision performance for a wide range of applications. All these features, combined with its compatibility and safety mechanisms, make SHINKAWA UTC-2000 an ideal choice for die and wafer fabrication.