Used SHINKAWA UTC-2000S #293648482 for sale

SHINKAWA UTC-2000S is a fully automated, multi-function, stand-alone wire bonding machine that is designed to provide high-precision and high-yield solutions for a variety of wire bonding applications. UTC-2000S utilizes a industry-leading linear scan type motion control equipment allowing the machine to accurately move and bond the wire with great precision and accuracy. This system also features feedback systems that gives feedback to the machine operator to keep the bond accuracy and precision at an optimal level. Additionally, SHINKAWA UTC-2000S can be customized to match its application's individual needs. The machine's bond head is designed to be smooth, quiet, and designed to reduce airborne objects during bonding through its extremely low-vibration operation. The bond head is also equipped with a high-precision pawl and thread unit, allowing for easy and accurate wire bonding. UTC-2000S is capable of bonding wire sizes that range from 0.025 mm to 0.10 mm. The machine also has a wire reversal feature that allows for multiple passes on the same bond spot at different angles and directions. SHINKAWA UTC-2000S offers a variety of bonding processes, such as ball-bonding, wedge-bonding, and stitch/run bonding. It is also equipped with an integrated quality control machine, which includes an integrated image quality inspection and an edge angle recognition tool, ensuring a high-quality bond result. UTC-2000S features a user-friendly, intuitive HMI which makes operation easy, even for less experienced users. The machine also offers an auto-adjustment asset to reduce set-up time and a remote monitoring function allowing the user to receive notifications of errors and problems. With its automated design and high-precision capabilities, SHINKAWA UTC-2000S is becoming an important part of the industrial wire bonding process's demand for reliability and accuracy. With its stellar performance and wide range of features, UTC-2000S is a great choice for high-yield, precision wire bonding jobs.