Used SHINKAWA UTC-231 BI #9078242 for sale

SHINKAWA UTC-231 BI is a highly advanced wire bonder designed for use in the manufacture of semiconductor devices. It is equipped with a powerful bonding engine designed to perform all standard wire bonding operations with precision and reliability. UTC-231 BI features an ergonomically designed workstation, providing easy access to the bonding chamber, display, and control panel. It is the first wire bonder to utilize a large, flip-up screen mounted directly on the top of the bonding chamber. This allows for instant visual inspection of each bond and the ability to fine-tune each bonding operation. SHINKAWA UTC-231 BI is equipped with a unique wire separation equipment. This system separates both wire shapes and sizes into separate channels, improving accuracy by easily selecting the correct wire size and shape for each bonding job. It also promotes higher production yields by reducing wire breakage and resulting errors. The bonder is capable of performing wire bonds on virtually any semiconductor device, from integrated circuits (ICs) to LED dies. It also features real-time monitoring and adjustment to optimize bond conditions. UTC-231 BI is equipped with a high-resolution camera unit. This allows the user to view the bond process in high detail, enabling them to make precise adjustments as necessary. An overhead camera machine allows users to thoroughly inspect each bond by comparing the post-bond shape to the original bond pattern. This tool also provides tweezers camera monitoring for real-time monitoring of the bond process. SHINKAWA UTC-231 BI also offers a variety of advanced safety features and control options. This includes an automated wire feed asset that automatically adjusts to the selected bond type, ensuring correct wire size and shape are presented to the bonding tool. The bonder is also designed to integrate into a variety of automation and control systems, allowing users to maintain tight quality control over their wire bonding operations. In conclusion, UTC-231 BI is an advanced wire bonder designed to provide reliable and precise semiconductor device manufacturing. It features a variety of advanced safety and control features, making it an ideal choice for any manufacturing facility.