Used SHINKAWA UTC-250 BI #9069035 for sale

SHINKAWA UTC-250 BI
Manufacturer
SHINKAWA
Model
UTC-250 BI
ID: 9069035
Bonders.
A SHINKAWA UTC-250 BI is a ultrasonic wire bonder designed to meet the demands of high volume and today's precision process requirements. This automated and user friendly equipment is capable of bonding gold ball and wedge, wire, ribbons and IC pins, while providing a reliable, repeatable and accurate process. With its advanced micro-processing control technology and interactive software system, it is the ideal choice for high volume production of printed circuit boards and semiconductor components. SHINKAWA UTC 250 BI features an 11-axis design, which offers reliable and precise motion control. It is equipped with a fast, smooth, and variable speed drive, a high-resolution color LCD monitor, and advanced digital controllers. It also has a wide range of bonding speeds and wire lengths, allowing it to process complex and sophisticated tasks with ease. In addition, UTC-250 BI is designed with a built-in sensor calibration to ensure consistent and repeatable performance. It is also equipped with an automated indexing unit for accurate registration and reliable wire loop size control. The machine is compatible with a variety of different ultrasonic, roller and flat wire bonding tools. UTC 250 BI offers superior reliability and repeatability in addition to a high degree of accuracy and flexibility for various complex wire bonding operations. It is capable of working with various materials and substrates such as ceramics, aluminum, and even gold. This machine is equipped with a unique positioning machine and an automated precision welding tool that can be adjusted to provide high accuracy and uniformity during the wire bonding process. In summary, SHINKAWA UTC-250 BI is an advanced and reliable ultrasonic wire bonder designed for high volume production and process requirements. It is efficient, precise, and easy to use. This machine is designed with superior accuracy and flexible process parameters, providing a reliable, repeatable and accurate bond while enabling complex and sophisticated tasks with ease.
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