Used SHINKAWA UTC-250 #164652 for sale

SHINKAWA UTC-250 is a robust, user-friendly bonder designed specifically for high-volume production. It is a three-axis linear bonder utilizing a fast, ultra-precision, multi-axis positioning stage to accurately locate and bond products. UTC-250 utilizes widely accepted ceramic and steel wedge bonding and thermosonic ball bonding (TBB) processes to optimize the production process. Its advanced user-friendly commands provide quick and accurate control of the bondhead motion, wire tension and velocity, with the optional touch monitor offering all the necessary functions for advanced programming. SHINKAWA UTC-250 utilizes a powerful, yet energy efficient AC brushless motor which provides a quieter and faster operating environment for the bonding process. Its built-in thermal tracking algorithm continuously adjusts and monitors the temperature of the bondhead, preventing overheating and improving accuracy and efficiency. UTC-250 provides excellent bondhead performance, accurate and reliable motion control with its high-performance motion controller, and easy-to-use touch monitor that simplifies the programming process. It is highly programmable with up to 10,000 user programs and is capable of controlling up to four bondheads simultaneously. SHINKAWA UTC-250's minimized footprint and exceptional reliability make it an ideal choice for high-volume production, especially within the automotive and medical industries. Additionally, its maximum bond force of 10,000g can withstand large deformations and its unique vibration compensation feature eliminates any unwanted vibration on the bondhead, resulting in consistent and assured bondheads.