Used SHINKAWA UTC-300 BI Super #293639581 for sale

SHINKAWA UTC-300 BI Super is a top-of-the-line, automated wire-bonder that offers precise and cost effective wire-bonding capabilities. With its high speed and precise control, this bonder excels at a variety of tasks in the industrial realm, including precise wire bonding and insertion, as well as other intricate component assembly. UTC-300 BI Super is designed to be used in the assembly of highly precise, top-quality products. The bonder features a fully automated program control and has a general memory capacity of 256 steps, which can be stored for use later. The monitor data and graphic display help ensure accuracy and reliability, while the HiAmp Probe and Pulse Fixture allow for precise wire-bonding and insertion respectively. The Wire Cut and Form Unit also offers a reliable way to cut and form wire. The machine is powered by ultra-high frequency (UHF) power supply, allowing the user to adjust frequency levels and durations to suit their application. The powerful UHF powers SHINKAWA UTC-300 BI Super to bond a variety of wire sizes with ease, with a wide bonding range up to a maximum of 1.0mm diameter. The bonder is capable of handling a variety of materials, including lead and aluminum wire, providing high levels of electrical insulation. The bonder also comes equipped with a protective shell to keep the system safe and dust free, while still allowing the user access to the maintenance and programming components. UTC-300 BI Super is designed for industrial use, and is the ideal choice for applications where precision and reliability are essential. The bonder is robust and easy to use, meaning that even inexperienced users can quickly become proficient. The machine can also be connected to other SHINKAWA scanning systems for added efficiency, making it an excellent choice for a variety of industrial applications.