Used SHINKAWA UTC-300 BI #293639584 for sale

SHINKAWA UTC-300 BI is a state-of-the-art ultrasonic bonding equipment designed to weld a wide variety of materials. It features an ultra-high speed, precision stitching capability and accurate, repeatable joining of flexible materials to rigid substrates. This bonder utilizes an array of high-frequency ultrasonic transducers to create a powerful shockwave which is used to bond the components together. SHINKAWA UTC-300BI offers a high-end bonding process that is superior to conventional joining techniques. It features a unique exchangeable transducer set, allowing a wide range of substrates to be bonded reliably. The exchangeable transducer set is capable of solving issues such as high stress concentration, off centered joints, low bonded strength, and poor bonding surface preparation. In addition, this system has a wide range of weld head motion capabilities which include the options for stationary, inverted, and rotary welding motions, as well as an auto-positioning feature for quick and efficient setup. UTC-300 BI has a user-friendly control interface with an online security unit. This machine is designed for continuity and comes with an integrated sequence manager for controlling, programming, and monitoring all bonder operations. This bonder also features an integrated data logging tool that allows for the storage and recall of welding information. This valuable data can be used to diagnose problems in a process and make adjustments as needed to ensure optimal results. With the help of advanced actuators, servo technology, and high-frequency ultrasonic systems, this bonder is a reliable and effective way to bond flexible materials to rigid substrates. UTC-300BI is an excellent choice for those looking for a reliable, efficient, and accurate bonding solution.