Used SHINKAWA UTC-300 BI #9260642 for sale

SHINKAWA UTC-300 BI is a bonded ultrasonic processor that is designed to perform 3D bonding and welding operations. SHINKAWA UTC-300BI is designed for efficient and precise bonding of various materials, giving excellent repeatability and accuracy. It is able to bond products of various shapes and sizes, thanks to its automatically programmable operation and programmable bonding support table. UTC-300 BI is equipped with an ultrasonic power generator for consistent power control, to ensure a consistent, superior bond quality. The two-axis X-Y drive unit allows for precise and smooth movements of the ultrasonic tool head and bond head to ensure optimal performance. UTC-300BI is equipped with a high-resolution color monitor and intuitive user-friendly software to allow the operator to easily and quickly control the operation. This makes the bonding operation more efficient and helps promote quick product development. The device also features advanced control features such as load optimization and load traceability. Load optimization helps to minimize the load impact on the part surface during welding, improving the quality of the weld. The load traceability function enables tracking of welding load values, allowing for improved process control. SHINKAWA UTC-300 BI is also provided with a range of enhancement options such as needle vibration device and a geometrical recognition system. The needle vibration device reduces thermo-mechanical shock and improves weld quality. The geometrical recognition system gives improved workability and accuracy. SHINKAWA UTC-300BI is a highly reliable and efficient bonded ultrasonic processor which provides superior bond quality and repeatability. The device offers a simple, user-friendly operation with advanced features for enhanced performance. This makes it an ideal choice for a wide range of industrial applications.