Used SHINKAWA UTC-300 BI #9260643 for sale

SHINKAWA UTC-300 BI
Manufacturer
SHINKAWA
Model
UTC-300 BI
ID: 9260643
Vintage: 1998
Wire bonder 1998 vintage.
SHINKAWA UTC-300 BI is a reliable, high performance, fully automated bonder for handling high throughput bonding processes. It offers a wide range of features and capabilities, including a high speed multi-pass equipment for ultra-fast, precise and high-throughput bonding processes. The system offers a linear motion X-Y bonder platform with a maximum speed up to 480mm/min and a wide temperature range of 40 - 350°C to deliver perfect soldering-temperature and quality on a range of bonded products. The unit is equipped with an 8" metal bonding head and a 7"x2.3" 25µm vacuum hole platen to bond a wide range of materials and substrates. The unit's optimized software and 8-point bond accuracy helps to ensure that parts are precisely placed and the perfect amount of glue and solder is deposited on the parts. The bond head can be adjusted in the X and Y directions for maximum angle and pressure application, enabling the user to create ideal bonds for a variety of applications. Highly accurate thickness control is one of SHINKAWA UTC-300BI's biggest advantages. It employs sophisticated algorithms to ensure precise bonding results, even with large substrate size variations. To further increase accuracy, an automatic temperature calibration machine is available, allowing the user to set different temperature values for each bonding product. The tool is also designed to be highly reliable and work with minimal downtime. It has an efficient rapid start-up feature that enables operators to quickly set up the asset and start their production process fast. UTC-300 BI also supports a wide range of materials and substrates up to 32 ounces. Its built-in safety features ensure that operators are protected from potential harm when working with this bonder. UTC-300BI is a solid choice for the most demanding bonding processes. It is easy to set up and maintain and can handle high-throughput bonding operations with precision and reliability. Its wide variety of features make it an ideal option for higher productivity, improved quality and increased safety.
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