Used SHINKAWA UTC-300 BI #9260726 for sale

SHINKAWA UTC-300 BI is a high quality, automated wire bonder that has been designed to meet the high standards of production and quality control required in the electronics manufacturing industry. This state-of-the-art machine uses advanced, computer-controlled flat-panel and rotary-axis technologies to enable precise and accurate wire bonding operations. SHINKAWA UTC-300BI features a high-speed rotary-EPM (Enhanced Pinning Machine) technology that can bond any wire size from 0.3 to 1.2 mm. It also features multiple bonding mode options, multi-tool nozzle kits for various wire lengths, and an auto-calibration function that automatically adjusts operation parameters for each operation. The machine also offers an integrated process monitoring software that allows for complete control of the process, with options to customize settings for product type, material and bond strength. UTC-300 BI can also be used in both in-line and hand-off circumstances. The machine is capable of handling wire bonding operations of varying production volumes, with a working space of up to 10 x 9.7 inches (254.8 x 246.3 mm). It also has a bonding speed of up to 40,000 bonds per hour. UTC-300BI is constantly monitored, with an integrated data logging system and a sophisticated process control function that allows for visualization and tracking of wire bond process trends. This system allows operators to quickly detect any process irregularities and quickly identify and rectify them. In addition to its production capability, SHINKAWA UTC-300 BI also boasts of a robust safety system that can detect, diagnose and prevent any possible hazardous conditions. Such features include an emergency stop function and an intuitive, easy to understand and navigate user interface. Overall, SHINKAWA UTC-300BI is an ideal solution for high-volume wire bonding applications, offering a wide range of features, customized settings and reliable, repeatable results. The machine guarantees perfect wire bonding results every time, making it an indispensable tool for any successful electronics manufacturing.