Used SHINKAWA UTC-300 #9055796 for sale
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ID: 9055796
Wire bonder
Gold wire ball bonding
Bond area: 56 x 66 mm
Currently installed
Parts machine.
SHINKAWA UTC-300 is a heavy-duty resistive bonder built for precision and durability in an industrial or laboratory setting. This device is ideal for the bonding of ultra-thin metal wires with high accuracy and repeatability. The easy-to-operate bonder boast a unique patented design with high flexibility and various other features to ensure high-quality bonds, fast cycle times and minimal scrap. SHINKAWA UTC 300 bonds using the unique EFO technology which allows for a smaller head size, resulting in faster cycle times, higher accuracy and improved dimensional accuracy. Its superior design minimizes the contamination in the environment meaning that it is extremely clean and environmentally friendly. The ultra-fast servo motors provide a fast, accurate, repeatable and reliable bond. The bonder comes with a variety of features such as auto-recipes, auto-stability, auto-calibration and fast setup menus. This provides users with greater ease of use and the complexity of bonder settings is reduced allowing for more efficient operation. The bonder is compatible with digital signal processors and can handle a variety of metals including copper, gold, nickel and silver. It is capable of bonding at various thicknesses such as 0.2mm, 0.5mm up to 2mm. The compact design of UTC-300 makes it ideal for high-volume applications in the automotive, aerospace, consumer electronics and medical industries. It has a long life cycle with an average life span of 10 years. This bonder has also been designed with user safety in mind and features safety protectors for all components. UTC 300 is an excellent choice for precise and reliable resistive bonding in an industrial or laboratory setting. Its superior design, powerful features and comprehensive safety features make it one of the most trusted and reliable bonders on the market.
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