Used SHINKAWA UTC-300 #9124526 for sale

SHINKAWA UTC-300
Manufacturer
SHINKAWA
Model
UTC-300
ID: 9124526
Vintage: 2010
Wire bonders, SOT, 2010 vintage.
SHINKAWA UTC-300 is a thermo-compression bonder specifically designed for thin, flexible printed circuit boards (PCBs). It provides superior bonding performance due to its advanced micro-heater technology. SHINKAWA UTC 300 utilizes a powerful 4-quadrant clamping mechanism and a unique P31 clamp control. This combination provides superior contact between the bonding heads and the board, resulting in better control over current flow. This ensures that the bond strength is optimized and consistent. UTC-300 comes with a fine-pitched heating fixture that is tuned for optimal heating. In combination with a built-in temperature control equipment, UTC 300 ensures a precise and repeatable temperature profile throughout the bonding process. This ensures that the soldering parameters are correct and that the board is not damaged. SHINKAWA UTC-300 includes an advanced safety system. This includes a built-in overload protection and thermal cut-off. This ensures that the unit does not overheat and that all components and boards are protected from damage during the bonding process. SHINKAWA UTC 300 is extremely user-friendly and includes a user-friendly touch screen. This helps users to quickly configure and setup the machine and bonds quickly and accurately. Additionally, a quality control tool is included. This helps to ensure that the bond strength is within the desired tolerances and that the board is not damaged during the bonding process. UTC-300 is perfect for high-volume PCB production lines as it can bond up to 60 boards per hour. It is also extremely reliable and robust, and stands up to industrial usage. Its user-friendly touch screen allows users to quickly select pre-defined bonding programs, which ensures that the board will be quickly and accurately bonded together. Overall, UTC 300 is an excellent thermo-compression bonder that delivers superior bonding performance. Its robust build and user-friendly touchscreen ensure that users can quickly and accurately bond their boards together, making it ideal for high-volume PCB production lines.
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