Used SHINKAWA UTC-300 #9124527 for sale

SHINKAWA UTC-300 is a fully automated bonding equipment designed for assembly of technical components and products. This bonder is ideal for use in electronics, automotive, medical, aerospace and other industrial applications. It features a vacuum rotary chuck fixture with three lower heads for heating different levels simultaneously and a lift arm to transport parts from station to station. SHINKAWA UTC 300 also includes programmable functions for optional application of sealant, bubbles, conformal coating or potting. UTC-300 bonder has a temperature range from ambient to 350°C and a pressure range of 0-20 bar. It is capable of bonding different materials, including metals, semiconductor materials, and composites. The bonder's operation is CPU controlled and is compatible with Ethernet as well as a range of other industrial protocols. It is equipped with a generous injector hopper and high precision flow control valves, allowing for managed volume outputs and precise bond placement. Built with safety and convenience in mind, UTC 300 has several safety features such as light curtains, a safety interlock system, emergency stop and an infrared heater safety switch. Its ergonomically designed operator control panel features a touch screen with eight programmable sets for user-friendly manual or automatic operation. As it is a stand-alone unit, it also has the capacity to be integrated with automated production systems. To ensure reliable bonding, SHINKAWA UTC-300 bonding machine is designed with high precision motion control and quartz-controlled time-motion curves to ensure accurate bond quality. It is also designed with high accuracy vacuum seal protection, to ensure high performance in tight spaces. Its compact design makes it suitable for tight space applications. SHINKAWA UTC 300 is ideal for high volume, precise bonding and coating needs. The user-friendly design, accurate bond placement, reliable safety features and highly precise control make this bonder suitable for use in a variety of applications. Additionally, UTC-300 bonds up to a size of 400 x 400 x 75 mm with an accuracy of 0.2mm, making it an economical and efficient solution for users.