Used SHINKAWA UTC-3000 WE #9261669 for sale

Manufacturer
SHINKAWA
Model
UTC-3000 WE
ID: 9261669
Vintage: 2013
Wire bonder 2013 vintage.
SHINKAWA UTC-3000 WE Bonder is a versatile and powerful automated wire and die bonding machine designed for precision bonding and interconnect applications. It features advanced Hybrid Electric Motor (HEM) technology, optimized process control, and superior thermal efficiency. The machine is suitable for a variety of industrial and scientific applications ranging from winding and die bonding tasks to microelectronic packaging, ribbonization, and microassembly. SHINKAWA UTC-3000WE Bonder is a benchmark machine capable of performing precision wire and die bonding tasks with high productivity and accuracy. The machine features advanced HEM technology, providing high-performance and reliable operation for a variety of demanding industrial and scientific applications. The machine is built on advanced control systems, featuring a state-of-the-art process controller with user-friendly operator interface. It offers advanced features such as automatic sub-micron positioning accuracy, integrated CCD vision system, temperature control via thermoelectric cooling. UTC 3000 WE Bonder is equipped with a high-speed wire drive spindle, able to achieve break-away and acceleration rates as low as 0.05 msec/wire for high-precision wire bonding tasks. The process module is equipped with an optimized taper turret, enabling superior thermal efficiency and bond quality. The machine is equipped with an optimized aluminum dampening turret, allowing for exceptionally accurate and repeatable die bonding processes. Additionally, the machine features an integrated Dynamic Height Control (DHC) system designed for improved stability over multiple bond cycles, ensuring reliable and repeatable bonding performance. The machine is designed for enhanced productivity, featuring user-friendly and intuitive interface for easy programming and setup. It features a high speed of up to 40 process steps per second, capable of completing large bonding cycles quickly and efficiently. The machine is capable of processing a variety of materials, including gold, silver, copper, and aluminum bonding wires. SHINKAWA UTC 3000 WE Bonder is designed for reliability and longevity, featuring robust construction and superior thermal protection to ensure long-term safe operation. The machine is serviceable and upgradeable, allowing for easily updating and replacing worn or damaged components.
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