Used SHINKAWA UTC-3000 WE #9261675 for sale

SHINKAWA UTC-3000 WE is a high performance bonder designed to precisely align and bond a variety of substrates quickly and accurately. The bonder is capable of executing a high throughput rate of 5,000 bonds per hour with a minimal reflow time of 3.5 seconds. It provides end users with an accurate, reliable and repeatable bonding process, perfect for automated production lines. The bonder features a mechanical XY alignment system and two independent XYZ moving stages. This design provides for increased core accuracy and flexibility. The combination of the multiple services makes it possible to align substrates with greater precision and flexibility in terms of shape, size and surface area than traditional bonders. SHINKAWA UTC-3000WE utilizes a vacuum arm design for maximum productivity. This feature significantly improves device placement accuracy and eliminates the need for time-consuming manual alignment. The bonder is also capable of bonding in a wide variety of materials and allows for easy switching between different types of bonding materials, such as surface activated adhesives, thermosetting adhesives and thermosetting adhesives with thick films. UTC 3000 WE's advanced multi-head configuration enables efficient automations and reduces downtime by utilizing the independent XYZ moving stages to concurrently position multiple substrate levels. This is further enhanced by the use of a mechanical memory system which eliminates the need for a user to reprogram the bonder after the position has been selected. In addition, the bonder is equipped with built-in diagnostics for comprehensive equipment evaluations. This allows the user to monitor the status of the bonder and quickly detect any potential problems. The diagnostics can also be used to provide feedback regarding alignment accuracy, as well as any inconsistencies that may be present in the bonding process. Overall, UTC-3000 WE is a powerful bonder equipped with an efficient design, superior accuracy and reliable performance. It enables users to realize high productivity, quality bonding and easy integration into automated production lines.