Used SHINKAWA UTC-3000 WE #9285050 for sale

SHINKAWA UTC-3000 WE is the newest model of bonder from SHINKAWA, a company that specialises in microelectronics assembly equipment. It is capable of locally bonding, soldering, and spot welding on all types of semiconductor devices with up to three bonding and/or wirebonding configurations. With its range of features, this device is ideal for any application needing a high-precision bonder. SHINKAWA UTC-3000WE is composed of five distinct elements, including a microprocessor-controlled control unit with touch screen LCD display, a vacuum/pressure welding head/manipulator selection, a precision motorized stage equipment with an X-Y-T axis, a vacuum chuck for handling delicate bonding substrates, and a spot bonder system with various tool configurations. The control unit offers automatic temperature and timing control as well as a library of preprogrammed recipes which can be loaded to facilitate rapid setup for bonding operations. The welding head/manipulator selection features a two-dimensional, push-pull, rotational and linear precision motion unit that can be used for various types of bonders including thermocompression, ultrasonic, hotbar, and laser. A high-precision X-Y-T axis stage is included which allows precise positioning with a repeatability tolerance of 0.1μm. A vacuum chuck is provided for securely handling delicate substrates, while also providing an optimal environment for bond completion. Finally, the spot bonder machine offers various tool configurations for welding up to three different arms. UTC 3000 WE is designed to enable consistent, high-precision bonding operations. It can handle a wide variety of substrates, such as copper, gold, silver, aluminum, copper alloys, nickel, or aluminum alloys. It is also designed for easy and fast setup, with its advanced control unit supplying various programmable parameters. Overall, UTC-3000WE provides flexibility, precision, and accuracy in one powerful Bonding tool for the most demanding applications.