Used SHINKAWA UTC-3000 #293617089 for sale

SHINKAWA UTC-3000 is an advanced high-performance bonder for a wide range of materials, including semiconductor chips and substrates. It is the perfect choice for automated assembly applications that require the highest levels of accuracy and repeatability. The machine features an intuitive touchscreen interface and a range of advanced features to ensure maximum efficiency and productivity. The machine is capable of bonding a range of materials, including semiconductor chips, substrates, and ceramic components. It also uses a variety of bonding methods including wire-bonding, stud-bonding, ultrasonic bonding and TAB bonding. In addition to this, the machine has an onboard computer to provide real-time feedback on the progress of the bonding process. The machine is designed to meet the highest quality requirements in terms of repeatability and accuracy. The adjustable bonder head can be easily calibrated, while an ergonomic design makes it easy to use. The machine has a load capacity of up to 25 lbs. and a maximum bond speed of 10 mm/s. The loading and unloading of the substrates is also quick and easy, without the need for special tools. The machine is also equipped with a range of safety features, including an ESD discharge system and safety switches. The machine is enclosed in a smart, dustproof enclosure to protect the user from electric shock and dust particles. In addition, a range of servicing tools comes as part of the package, including an LED microscope and a selection of lasers for fine adjustment of the bonder arm. Overall, SHINKAWA UTC 3000 is an advanced high-performance bonder, designed to meet the highest requirements in terms of accuracy and repeatability. Its intuitive touchscreen interface, range of advanced features and safety measures make it the perfect choice for demanding assembly applications.